R Dataset / Package rpart / solder


On this R-data statistics page, you will find information about the solder data set which pertains to Soldering of Components on Printed-Circuit Boards. The solder data set is found in the rpart R package. You can load the solder data set in R by issuing the following command at the console data("solder"). This will load the data into a variable called solder. If R says the solder data set is not found, you can try installing the package by issuing this command install.packages("rpart") and then attempt to reload the data. If you need to download R, you can go to the R project website. You can download a CSV (comma separated values) version of the solder R data set. The size of this file is about 18,893 bytes.

Soldering of Components on Printed-Circuit Boards


The solder data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.




This data frame contains the following columns:


a factor with levels L, M and S indicating the amount of clearance around the mounting pad.


a factor with levels Thick and Thin giving the thickness of the solder used.


a factor with levels A1.5, A3, B3 and B6 indicating the type and thickness of mask used.


a factor with levels D4, D6, D7, L4, L6, L7, L8, L9, W4 and W9 giving the size and geometry of the mounting pad.


1:3 indicating the panel on a board being tested.


a numeric vector giving the number of visible solder skips.


John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.


fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
             data = solder, method = "anova")
plot(predict(fit), residuals(fit))

Dataset imported from https://www.r-project.org.

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Attachment Size
dataset-82278.csv 18.45 KB
Dataset License
GNU General Public License v2.0
Documentation License
GNU General Public License v2.0

This documentation is licensed under GPLv3 or later.